选择性钛蚀刻液( Selective Ti etching chemical)
After our Cu and Ti etching, the undercut < 0.2um when the pitch
is 5 um!
TE-168: 选择性钛蚀刻液 (20L /桶)
(H2O2 base selective Ti etching chemical)
TE-F168: 含氟钛蚀刻液 (20Kg /桶)
(Flourine base, but not HF)
主要特性为其蚀刻速率比双氧水base快,且药水成本低!(非氢氟酸HF base)