MIT mainly produces and developes not only good performance but also lower cost chemicals for customers. One of the most famous and wild application from now to the future is our Selective Ti & Cu etching chemical!
Our Ti etching chemical(TE-168) has below advantages:

1. High etching rate ( 500A/min at room temperature).
2. Longer bath life and lowest cost (Per liter Ti etching chemical can etch > 25 pieces 12" 
    wafer  which thickness is 1000A of Ti or TiW).
3. Temperature is stable, it will not go up during Ti etching process.
4. No attach the other metal layer as Cu, Al, Sn, Ni...
5. It can be used for fine pitch or RDL process due to it's undercut is very small
    (When pitch < 5um, the undercut can be less than 0.2um after Cu and Ti etching).

So our etching chemicals have both advantages of high throughput and low cost!

Services: Ti etching chemical,Cu etching chemical,Ni etching chemical,NiCr etching chemical,PR remover,Dry Film Stripper,Developers,Customerlize