選擇性鈦蝕刻液( Selective Ti etching chemical)
After our Cu and Ti etching, the undercut < 0.2um when the pitch
is 5 um!
TE-168: 選擇性鈦蝕刻液 (20L /桶)
(H2O2 base selective Ti etching chemical)
TE-F168: 含氟鈦蝕刻液 (20Kg /桶)
(Flourine base, but not HF)
主要特性為其蝕刻速率比雙氧水base快,且藥水成本低!(非氫氟酸HF base)